Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal...
Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical...
View ArticlePushing the Boundaries of Heat Pipe Operation
Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the...
View ArticleTiny Technology Making a Big Splash
Thermacore, Inc., a provider of heat pipe technology and other thermal management solutions, announced that Thermacore Europe is making progress as lead partner of an 8.3 million euro ($11.4M) European...
View ArticleApple Gets Patent on Method of Cooling Electronic Devices
Apple Inc., maker of the iPhone and the iPad, received a patent on a method of cooling an electronic device by using hinge assemblies that can conduct heat. Patent 7,746,631, which was issued June 29,...
View ArticleAustrian Company Acquires Electronic Component Producers
Miba, a partner to the international engine and automotive industry, has acquired two Austrian producers of power electronics components such as resistors and cooling systems for power electronics....
View ArticleGrapics Card Series Uses Heat Pipes to Cool GPU More Efficiently
The R6850-PM2D1GD5, part of the R6800 series of graphics cards recently launched by mainboard and graphics card manufacturer MSI, uses direct contact heat pipes to more efficiently cool the GPU. A 9cm...
View ArticleHeat Pipe-Assisted Heat Sinks for Power Electronics Cooling
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar...
View ArticleNASA Investigates Use of Heat Pipes on Space Station
Scientists launched an investigation called the Constrained Vapor Bubble, or CVB, to the International Space Station to look into the operation of a heat pipe in space. The Constrained Vapor Bubble is...
View ArticleHeat Sinks Feature Improved Tower Fin and Heat Pipe Layout
Cooler Master’s Hyper 212 EVO and Hyper TX3 EVO CPU Coolers have an improved tower fin design, heat pipe layout, upgraded fans and fan brackets. All of which provides an even more extreme value for...
View ArticleRequest For Proposals By The Toyota Research Institute of North America
The Toyota Research Institute of North America (TRINA), Electronics Research Department (ERD), is seeking research proposals on two technical topics. Application can be found below TRINA,...
View Article
